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Free Form™ AIR HT

Mold Max™ 25 vs. Free Form™ AIR HT

High Temperature Epoxy Dough

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Mold Max™ 25

Mold Max™ 25 vs. Free Form™ AIR HTFree Form™ AIR HT

High Performance Silicone Rubber

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Key Differences

Product Type
  • Epoxy Putties
  • Silicone Rubber - Tin Cure
Mixed ViscosityDough25,000 cps
Mix Ratio By Volume2A:1BN/A (gram scale required)
Pot Life150 minutes60 minutes
Cure Time16 hours24 hours
Shore D Hardness55
Shore A Hardness25
Specific Volume54.31 cu. in./lb.23.5 cu. in./lb.
ColorGreyPurple
Disclaimer
Although we do our best to ensure accuracy, Smooth-On offers no warranties, promises, and/or representations of any kind, either expressed or implied, as to the accuracy, completeness, or reliability of the information contained on this Compare Tool, nor suitability of the information contained herein to your particular circumstances. Smooth-On assumes no liability for losses or damages of whatever nature (direct, indirect, consequential or other) associated with your use, or inability to use, the Compare Tool, or from your use (or failure to use) the information contained herein. Other useful tools include product technical bulletins and our extensive FAQ section. You can also contact our technical support team.

All Technical Data

Free Form™ AIR HTMold Max™ 25
Product Type
  • Epoxy Putties
  • Silicone Rubber - Tin Cure
Mixed ViscosityDough25,000 cps
Mix Ratio By Volume2A:1B
Mix Ratio By Weight2A:1B100A:5B
Pot Life150 minutes60 minutes
Cure Time16 hours24 hours
Shore D Hardness55
Shore A Hardness25
Specific Gravity0.51 g/cc1.18 g/cc
Specific Volume54.31 cu. in./lb.23.5 cu. in./lb.
ColorGreyPurple
Die B Tear Strength130 pli
Tensile Strength577 psi
Elongation @ Break375 %
100% Modulus80 psi
Shrinkage0.001 in. / in.
Heat Deflection Temp300 °F
Useful Temperature (min)-65 °F
Useful Temperature (max)400 °F
Dielectric Constant, 100Hz3.29
Dielectric Strength330 volts/mil
Dissipation Factor, 100Hz0.005
Heat Deflection With Post Cure400 °F
Volume Resistance8.29E+11 ohm
Volume Resistivity5.83E+13 ohm/cm

Product Description

Free Form™ AIR HT

Free Form™ AIR HT is a low density, lightweight epoxy putty that offers high temperature resistance to 300°F/149°C when cured at room temperature and 400°F/204°C when heat post cured. This is a low-odor, low shrinkage formula that is easy to use. Free Form™ AIR HT is mixed by hand with a 2A:1B by volume or weight mix ratio. It offers a long working time and cures overnight at room temperature to a hard, rigid epoxy that is very strong with modeling board-like properties. It can be sanded, shaped, drilled, tapped and CNC machined/routered.

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Mold Max™ 25

Mold Max™ Silicones are tin-cured silicone rubber compounds that have exceptional working properties and library life. Mold Max™ Silicones feature Smooth-On’s exclusive “Libra™” catalyst for long library life. Mold Max™ silicones can be pigmented with Silc Pig™ silicone colorants. Pot life for the Mold Max™ 25  is 60 minutes and cures overnight at room temperature.

Vacuum degassing mixed material using a vacuum pump and chamber to remove entrapped air is recommended.

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